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PCB
IC carrier board PCB
Manufacturing process of IC carrier board Manufacturing process of IC carrier board 



 Copper pattern and plating

 

Remove the copper pattern required for the circuit and deposit a thin film on the laminated board. High precision copper plating using chemical processes. The thickness and shape of copper plating can be automatically adjusted.
 


 Solder mask

 

The solder mask layer is composed of an IC substrate and printed by filling the holes on the copper plating cover. For better and easier processing, the thickness of copper plated circuits should be kept below 10 millimeters.
 


 Surface Treatment

 

The most common surface treatment is EMIG or ENEPIG of gold alloys to achieve appropriate conductivity and uniform thickness surface treatment.
 


 Production testing

 

In the final stage, the IC substrate undergoes quality inspection to test its reliability and internal connectivity. The testing method includes using Gigs or end of line testers for reliable integration testing.









        
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            Haibo is an expert in the field of FPC/PCB manufacturing and surface mount assembly in China. Since our establishment in 2017, we have been providing high-quality PCBs to over 1000 customers worldwide. Our factory has passed ISO14001, ISO9001:2015, TS16949, and ISO13485:2016 certifications. We are one of the most trusted small and medium-sized FPC/PCB manufacturers in China.
            
    
            
    
                
      
                    
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