3 types of IC carrier board PCB manufacturing technologies-深圳市海博精密电路有限公司

There are three manufacturing processes for IC carrier boards: subtractive process (SP), additive process (AP), and modified semi additive process (MSAP). Each manufacturing process depends on the application and manufacturing cost.

The subtraction process is similar to the PCB manufacturing process of coating a layer of copper on a laminated board. Apply a dry film to protect the wiring and etch the remaining parts of the copper sheet. The manufacturing capability determines the minimum spacing, as it affects the width of the wiring and the accuracy of the plated holes. The minimum manufacturing space is 2 mil, and they are used for high-speed and high-density PCBs.

Another process is to chemically coat copper on top of the substrate and expose a thin film on top. Exposed to chemical components until reaching thickness. This process is additional, so the accuracy can reach 1 mil. This method is costly and requires more complex processes.

Copper clad laminates are laminated using copper electroplating. Add circuits and regions that require higher precision. Etch the next layer of copper and place a negative film on top of it. Flash corrosion may be more corrosive. This is a combination of subtraction and addition. This can improve production efficiency and cost-effectiveness, and can be adjusted according to board to board or application type.

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