Material characteristics of IC carrier PCB-深圳市海博精密电路有限公司

The selection of material properties is based on the functionality and performance of the circuit. They are divided into multi chip module substrate IC, rigid, flexible, and ceramic. The placement of the IC substrate and processor is shown in the following figure.

Multi chip module IC carrier board: Multi chip modules have high manufacturing costs, but can be used as substrates for packaging multiple ICs. This type of substrate is thin, lightweight, and compact. Due to the use of multiple chips on the substrate, the performance of multi chip IC substrates is slightly inferior and thermally unstable.

Rigid IC substrates: Resin is used to manufacture these substrates, typically using epoxy resin, but there are also several other types such as ABF (Ajinomoto Thickening Film), BT (Bismaleimide Triazine), with a thermal expansion coefficient between 12 and 17 ppm per degree Celsius.

Flexible IC substrate: The substrate is similar to a flexible printed circuit board and uses polyamide resin or polyimide as the substrate. The range of thermal expansion coefficient is 13 to 27 ppm/Celsius, which can provide better performance and thermal management.

Ceramic IC substrate: Ceramic substrates are made of aluminum nitride, silicon carbide, or aluminum oxide, with a low temperature coefficient of 6 to 8 ppm per degree Celsius.

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